LAMINATE AND MULTILAYER BOARD

摘要

PROBLEM TO BE SOLVED: To provide a laminate configured to reduce the surface roughness of an insulating layer and to increase adhesion between the insulating layer and a metal layer, and to provide a multilayer board including the laminate.SOLUTION: A laminate 1 includes: a base material 2 or metallic foil; and an insulating resin layer 3 layered on the surface of the base material 2 or the metallic foil. The insulating resin layer 3 is formed by using a resin composition containing resin having 8-10 SP value. The multilayer board includes a circuit board and the insulating layer disposed on the circuit board. The insulating layer is formed by using the laminate 1, and formed of the insulating resin layer of the laminate 1.