| 摘要 |
PROBLEM TO BE SOLVED: To provide methods, systems and system components for transferring, assembling and integrating features and arrays of features having selected nanosized and/or microsized physical dimensions, shapes and spatial orientations.SOLUTION: Methods of the present invention utilize principles of 'soft adhesion' to guide transfer, assembly and/or integration of features, such as printable semiconductor elements or other components of electronic devices. The methods are useful for transferring features from a donor substrate to a transfer surface of an elastomeric transfer device and, optionally, from the transfer surface of the elastomeric transfer device to a receiving surface of a receiving substrate. The methods provide highly efficient, registered transfer of features and arrays of features, such as printable semiconductor elements, in a concerted manner that maintains relative spatial orientations of transferred features. |
