FLEXIBLE INTRACRANIAL CORTEX MICROELECTRODE CHIP, PREPARATION AND PACKAGING METHOD THEREFOR, AND PACKAGING STRUCTURE THEREOF

摘要

A flexible intracranial cortex microelectrode chip (13) comprises a flexible substrate (1), a microelectrode unit (3), an electrode lead wire (4) electrically connected with the microelectrode unit (3), and a lead wire welding point (5) electrically connected with the electrode lead wire (4). The microelectrode unit (3), the electrode lead wire (4) and the lead wire welding point (5) are all disposed on the flexible substrate (1). The flexible intracranial cortex microelectrode chip (13) further comprises an insulating layer (2) disposed on the flexible substrate (1) and covering the electrode lead wire (4). A preparation method for the flexible intracranial cortex microelectrode chip (13), a packaging structure of the flexible intracranial cortex microelectrode chip (13) and a packaging method therefor are provided. The flexible intracranial cortex microelectrode chip (13) has good flexibility and can well fit cerebral cortex, to implement information detection and impose electrical stimulation, and can implement better flexible matching with the cerebral cortex, so that the attenuation of an organic response on the performance of the electrode can be effectively reduced in the long-term implantation process, and situations such as damage of tissues, inflammatory responses, incrustation and bleeding are less likely to occur.