| 摘要 |
PROBLEM TO BE SOLVED: To provide a card base material using a paper base material having recycle adaptability, a card and a method for manufacturing the card for improving physical strength.SOLUTION: An IC card includes: two opposite outermost layer paper base materials; two opposite outermost layer paper base materials arranged between the two outermost layer paper base materials; and inner layer paper base materials arranged between the two outermost layer paper base materials whose film thickness ranges from 100 μm or more to 300 μm or less. One base material between the outermost layer paper base materials and the inner layer paper base material of at least one layer adjacent to the base material are respectively formed with an opening, and a gap between the paper base materials is fixed and laminated by the fusion bond of thermoplastic resin such that the openings match, and an IC module having a contact terminal is provided at the opening. |
