| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique advantageous in securely insulating a conductor arranged penetrating a semiconductor layer in an easy method.SOLUTION: A solid state image pickup device which has a semiconductor layer 104 and a multi-layer wiring layer 102 includes an opening 108 which penetrates the semiconductor layer 104 and reaching a conductive layer 103 in the multi-layer wiring layer 102, a conductor 110 disposed in the opening 108 to be connected to the conductive layer 103, and a groove 109 surrounding the opening 108 and penetrating the semiconductor layer 104. The semiconductor layer 104 includes a wall portion WP disposed between a side face of the opening 108 and an inner side face of the groove 109 so as to surround the conductor 110. |
