RESIN COMPOSITION, LAMINATE AND PROCESS FOR PRODUCTION THEREOF, STRUCTURE AND PROCESS FOR PRODUCTION THEREOF, AND PROCESS FOR PRODUCTION OF ELECTRONIC DEVICE

摘要

The present invention relates to a resin composition containing: a polyimide silicone which has, in a silicone moiety therein, a crosslinking site at which a crosslinking reaction occurs upon heating at a second temperature, in which the crosslinking reaction proceeds by heating a third temperature that exceeds the second temperature further than the second temperature; and a solvent which vaporizes upon heating at a first temperature that is lower than the second temperature.