发明名称 |
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE |
摘要 |
A wiring substrate includes an insulation substrate including a first surface, a second surface on an opposite side of the first surface, and first and second through-holes penetrating the insulation substrate from the first surface to the second surface; a wiring layer formed on the first surface of the insulation substrate; a first via formed in the first through-hole and connected to the wiring layer; a bus line positioned away from the wiring layer and the first via, and formed on the first surface of the insulation substrate; and a second via formed in the second through-hole and connected to the bus line.
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申请公布号 |
US2013233607(A1) |
申请公布日期 |
2013.09.12 |
申请号 |
US201313773948 |
申请日期 |
2013.02.22 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
NAKAMURA ATSUSHI;NAKANISHI TSUKASA;MATSUMOTO TAKAYUKI;SATO KIYOKAZU;HOSHINO OSAMU |
分类号 |
H05K1/11;H05K3/40 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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