SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device which has excellent thermal and electromagnetic characteristics using a sheet member.SOLUTION: A semiconductor package 10 includes a package substrate 11 and a semiconductor chip 12 mounted on the package substrate 11 in a flip chip mounting method. A layer 13 including a housing part 13b housing the semiconductor chip 12 is disposed on the package substrate 11. A sheet 14 including a conductive part extends from an area on the semiconductor chip 12 to an area on the layer 13. An electrode 13c electrically connected with the package substrate 11 is disposed in the layer 13 at a region where the sheet 14 is disposed. The sheet 14 disposed from the area on the semiconductor chip 12 to the area on the layer 13 improves thermal and electromagnetic characteristics of the semiconductor package 10.