| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and a semiconductor apparatus which have high design flexibility.SOLUTION: A semiconductor element 20 is sealed by a resin 60 and is disposed in the resin 60. A source electrode material 30 is joined to the semiconductor element 20 and has a source pad 31 exposed on an upper surface of the resin 60. A drain electrode material 40 is joined to the semiconductor element 20 and has a drain pad 41 exposed on a lower surface of the resin 60. A gate electrode material 50 is joined to the semiconductor element 20 at the one end side and has gate pads 51, 52 which are respectively exposed on the upper surface and the lower surface of the resin 60 at the other end side. |
