发明名称 SETTLEMENT CONDITION MEASURING METHOD AND REFERENCE PIN FOR USE IN THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a settlement condition measuring method which enables an inclination of a building to be surely eliminated by accurately grasping settlement conditions of the building.SOLUTION: A settlement condition measuring method relating to the present invention, which is used to measure settlement conditions of a building, includes an installation step (S11) of preinstalling reference pins in a plurality of places flush with one another in the building, respectively, and a settlement measuring step (S13) of measuring the relative heights of the plurality of reference pins, after the settlement (S12) of the building.
申请公布号 JP2013181319(A) 申请公布日期 2013.09.12
申请号 JP20120045318 申请日期 2012.03.01
申请人 WATANABE SHINGO 发明人 WATANABE SHINGO
分类号 E04G21/18;E02D27/01;E02D35/00 主分类号 E04G21/18
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