发明名称 SURFACE TREATMENT STRUCTURE OF CIRCUIT PATTERN
摘要 A surface treatment structure formed on a circuit pattern on a printed circuit board is provided, which includes a first gold layer, a palladium layer, and a second gold layer stacked from bottom to top, respectively, or includes a palladium layer, and a second gold layer stacked from bottom to top, respectively. The palladium layer is used to prevent the diffusion of the copper ions from the circuit pattern. Only a thin surface treatment structure of the circuit pattern of the present invention is required to achieve excellent wire bonding, so that the overall thickness is reduced, and the manufacture cost is also reduced. Furthermore, the uniformness of palladium is better than that of nickel, and thereby the surface treatment structure of the circuit pattern of the present invention is suitably used for manufacturing the fine-line circuits, thereby having a wider industrial applicability.
申请公布号 US2013233602(A1) 申请公布日期 2013.09.12
申请号 US201213416158 申请日期 2012.03.09
申请人 LIN TING-HAO;WU YU-HUI 发明人 LIN TING-HAO;WU YU-HUI
分类号 H05K1/09 主分类号 H05K1/09
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