发明名称 |
SUBSTRATE FOR POWER MODULE |
摘要 |
Disclosed herein is a substrate for a power module. The substrate may include a metal base substrate, an insulating layer formed on the metal base substrate and including a plurality of insulating adhesion layers and a ceramic filler layer formed on a joining interface between the plurality of insulating adhesion layers, and a circuit layer formed on the insulating layer.
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申请公布号 |
US2013233599(A1) |
申请公布日期 |
2013.09.12 |
申请号 |
US201213484188 |
申请日期 |
2012.05.30 |
申请人 |
KIM KWANG SOO;LEE YOUNG KI;SUH BUM SEOK;SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM KWANG SOO;LEE YOUNG KI;SUH BUM SEOK |
分类号 |
H05K1/05 |
主分类号 |
H05K1/05 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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