发明名称 |
CONDUCTIVE MATERIAL, BONDING METHOD USING THE SAME, AND BONDED STRUCTURE |
摘要 |
A conductive material that includes a metal component consisting of a first metal and a second metal having a melting point higher than that of the first metal, wherein the first metal is Sn or an alloy containing 70% by weight or more of Sn, and the second metal is a metal or alloy which forms an intermetallic compound having a melting point of 310° C. or higher with the first metal and has a lattice constant difference of 50% or greater between itself and the intermetallic compound generated at the circumference of the second metal.
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申请公布号 |
US2013233618(A1) |
申请公布日期 |
2013.09.12 |
申请号 |
US201313868259 |
申请日期 |
2013.04.23 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
NAKANO KOSUKE;TAKAOKA HIDEKIYO |
分类号 |
H01R4/02;B23K1/00;B23K35/24 |
主分类号 |
H01R4/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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