METHOD OF MANUFACTURING WIRING SUBSTRATE

摘要

A method of manufacturing a wiring substrate includes: a process of forming a first laminate structure in which one or more conductor layers and one or more resin insulating layers are laminated on a supporting substrate; a process of laminating a metal core substrate, which has a metal layer disposed on the top main surface thereof, on the first laminate structure so that a bottom main surface of the metal core substrate comes in contact with the first laminate structure, and a process of forming a second laminate structure in which one or more conductor layers and one or more resin insulating layers are laminated on the metal core substrate.