| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing an organic light-emitting device including a thin film encapsulation layer which is flexible and excellent in sealing from its external environment.SOLUTION: A method of manufacturing an organic light-emitting device includes forming an organic emission unit 13 on a substrate 11, and forming a thin film encapsulation layer 20 that is in contact with at least one portion of a surface of an environmental element 15 and that includes at least one inorganic film 23" including a low temperature viscosity transition (LVT) inorganic material. The step of forming the inorganic film includes: forming a pre-inorganic film including the LVT inorganic material by providing the LVT inorganic material onto the organic emission unit on which the environmental element is present; performing a first healing process on the pre-inorganic film at a temperature greater than a viscosity transition temperature of the LVT inorganic material; and performing a second healing process on the pre-inorganic film having undergone the first healing process to increase binding force between the environmental element and the LVT inorganic material and to increase binding force among the LVT inorganic material. |
