发明名称 CONDUCTOR CONNECTION STRUCTURE
摘要 PROBLEM TO BE SOLVED: To reduce temperature rise of conductors by decreasing a heating value of a conductor connection part.SOLUTION: An outer diameter part of an inner peripheral side conductor 4a is adhered and fitted to an inner diameter part of an outer peripheral side conductor 3a. A ring 9 is disposed at a fitting part of the conductors 3a and 4a so as to surround an outer peripheral part of the outer peripheral side conductor 3a. The ring 9 is composed of a material having a smaller linear expansion coefficient than the outer peripheral side conductor 3a. A solid cylindrical member 10 is disposed inside the inner peripheral side conductor 4a in the fitting part of the conductors 3a and 4a. The cylindrical member 10 is composed of a material having a larger liner expansion coefficient than the inner peripheral side conductor 4a. A spring 11a is disposed between the outer peripheral part of the outer peripheral side conductor 3a and an inner peripheral part of the ring 9. A spring 11b is disposed between an inner peripheral part of the inner peripheral side conductor 4a and an outer peripheral part of the cylindrical member 10.
申请公布号 JP2013183501(A) 申请公布日期 2013.09.12
申请号 JP20120044630 申请日期 2012.02.29
申请人 TOSHIBA CORP 发明人 NAKATATE MASUMI;OGAWA SATOSHI;SHIRAI HIDEAKI;NAKANO OSAMU;SHIIKI MOTOHARU
分类号 H02G5/06;H02B13/02 主分类号 H02G5/06
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