发明名称 |
CONDUCTOR CONNECTION STRUCTURE |
摘要 |
PROBLEM TO BE SOLVED: To reduce temperature rise of conductors by decreasing a heating value of a conductor connection part.SOLUTION: An outer diameter part of an inner peripheral side conductor 4a is adhered and fitted to an inner diameter part of an outer peripheral side conductor 3a. A ring 9 is disposed at a fitting part of the conductors 3a and 4a so as to surround an outer peripheral part of the outer peripheral side conductor 3a. The ring 9 is composed of a material having a smaller linear expansion coefficient than the outer peripheral side conductor 3a. A solid cylindrical member 10 is disposed inside the inner peripheral side conductor 4a in the fitting part of the conductors 3a and 4a. The cylindrical member 10 is composed of a material having a larger liner expansion coefficient than the inner peripheral side conductor 4a. A spring 11a is disposed between the outer peripheral part of the outer peripheral side conductor 3a and an inner peripheral part of the ring 9. A spring 11b is disposed between an inner peripheral part of the inner peripheral side conductor 4a and an outer peripheral part of the cylindrical member 10. |
申请公布号 |
JP2013183501(A) |
申请公布日期 |
2013.09.12 |
申请号 |
JP20120044630 |
申请日期 |
2012.02.29 |
申请人 |
TOSHIBA CORP |
发明人 |
NAKATATE MASUMI;OGAWA SATOSHI;SHIRAI HIDEAKI;NAKANO OSAMU;SHIIKI MOTOHARU |
分类号 |
H02G5/06;H02B13/02 |
主分类号 |
H02G5/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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