| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed circuit board capable of preventing the generation of warping due to thermal contraction of a solder resist, in a drying step of the solder resist in a manufacturing step of the printed circuit board.SOLUTION: On a printed circuit board 1, in an area having a large distance between wiring patterns 5 on which thermal contraction force 8 of a solder resist 7 is greatly applied, a cut portion 6 of the solder resist 7 is provided vertically to an applying direction of the thermal contraction force 8. Therefore, the thermal contraction force 8 of the solder resist 7 is dispersed, and warping of the printed circuit board 1 is prevented. |
