发明名称 TRANSCEIVER AND INTERFACE FOR IC PACKAGE
摘要 An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.
申请公布号 US2013236186(A1) 申请公布日期 2013.09.12
申请号 US201313895571 申请日期 2013.05.16
申请人 SAMTEC, INC. 发明人 ZBINDEN ERIC;MUSSER RANDALL;VERDIELL JEAN-MARC ANDRE;MONGOLD JOHN;VICICH BRIAN;GUETIG KEITH
分类号 H04B10/40 主分类号 H04B10/40
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