SINTERED SILVER MICROPARTICLE COMPACT

摘要

A sintered silver microparticle compact for a joint material that is used for the joining of a part of a semiconductor device, said sintered silver microparticle compact having such properties that the activation energy for the creeping of the sintered silver microparticle compact is 0.4- to 0.75-fold of the activation energy for the lattice diffusion of bulk silver.