FOAM CURABLE BY HEAT

摘要

Foam (Q) curable by heat comprises 10-80 vol.% of at least a gas; and a composition, which can be cured by heat; where the composition comprises at least one isocyanate containing polyurethane polymer compound (I) and at least a curing agent, which can be activated by high temperature. Foam (Q) curable by heat comprises 10-80 vol.% of at least a gas; and a composition, which can be cured by heat; where the composition comprises at least one isocyanate containing polyurethane polymer compound of formula (I) and at least a curing agent, which can be activated by high temperature. R 1> : polyurethane polymer after removing all terminal isocyanate groups; R 2> : a blocking group, which split off over 100[deg] C, or an oxirane group of formula (II); R 3> : another blocking group, which splits off over 100[deg] C, or an oxirane group of formula (IIa); R 4>, R4a : (cyclo)aliphatic, aromatic or aryl aliphatic (p+1) and/or (f+1) valent hydrocarbon, which is optionally contains a heteroatom; p, f : 1-3; and either m, n, o : 0-7; or m+n+o : 2-8. Independent claims are included for: (1) the preparation of (Q) comprising either introducing the gas into the composition at 20-80, preferably 20-60[deg] C and atmospheric pressure by a mixing device and distributing the mixture, or injecting the gas, which exists in liquid or overcritical condition under pressure into the composition, by the mixing device, distributing the mixture and subsequently expanding the composition in the pressure tension; (2) a method for gluing the substrates S1 and S2 comprising (c1) applying (Q) on the substrate (S1), and (c2) contacting the applied (Q) with a second substrate (S2), or (d1) applying (Q) on the substrates (S1) and (S2) and (d2) gluing the coated substrates, where: the substrates (S1) or (S2) exhibits same or different heat stable material, where after the step (c2) and/or after the step (d2), one or more steps of hardening takes place at 100-220[deg] C, preferably 120-200[deg] C; (3) a method for sealing the substrates (S1) and/or (S2) comprising (e1) applying (Q) on the substrates (S1) and/or (S2) or (f1) applying (Q) between the surface of the substrates (S1) and/or (S2), where: the substrates (S1) or (S2) exhibits same or different heat stable material, where after the step (e1) and/or after the step (f1), one or more steps of hardening takes place at 100-220[deg] C, preferably 120-200[deg] C; (4) a method for defoaming of hollow structures comprising (g1) injecting (Q) into the hollow structure, where after the step (g1), one or more steps of hardening takes place at 100-220[deg] C, preferably 120-200[deg] C; (5) a method for coating or sealing the substrates (S1) comprising (h1) applying (Q) on the substrate (S1), where after the step (h1), one or more steps of hardening takes place at 100-220[deg] C, preferably 120-200[deg] C; and (6) a heat cured foam obtained from (Q). [Image] [Image].