METHOD OF MANUFACTURING A CAVITY PRINTED CIRCUIT BOARD

摘要

PURPOSE: A manufacturing method of a cavity printed circuit board (PCB) is provided to make the thickness of a board slim by applying a recess structure. CONSTITUTION: Third copper foil is formed on the surface of dissimilar metal (40), the surface of first copper foil (10c), and the surface of second copper foil. A copper foil pad of a circuit pattern is formed on the surface of the dissimilar metal. The surface of a first insulating layer is exposed. A cavity in which the bottom surface is formed of the first copper foil is formed. The copper foil pad is exposed to the bottom surface of the cavity.