发明名称
摘要 <p>Provided are a polishing slurry for metal films and a polishing method which restrain the generation of erosion and seams, and makes the flatness of a surface polished therewith or thereby high. The slurry and the method are a polishing slurry, for metal films, comprising abrasive grains, a methacrylic acid based polymer and water, and a polishing method using the slurry, respectively.</p>
申请公布号 JP5287720(B2) 申请公布日期 2013.09.11
申请号 JP20090521676 申请日期 2008.07.04
申请人 发明人
分类号 H01L21/304;B24B37/00;C09K3/14 主分类号 H01L21/304
代理机构 代理人
主权项
地址