发明名称
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a ceramic component that can accurately form an internal wiring conductor in a ceramic base part without any position shift. <P>SOLUTION: In a recessed part forming stage, a recessed part 44 having a bottom part 43 is formed in an unsintered ceramic molding 41, and in a conductor charging stage, an unsintered conductor 49 is charged in the recessed part 44. In a laser processing stage, the unsintered conductor 49 is partially removed by laser irradiation while left on the bottom part 43 to form a hollow 50 in the unsintered conductor 49. In a ceramic material charging stage, an unsintered ceramic material 51 is charged in the hollow 50. Then a baking stage is carried out to sinter the unsintered ceramic molding 41, unsintered ceramic material 51, and unsintered conductor 49 at the same time, thereby forming the internal wiring conductor embedded in the ceramic base part and also forming a non-through via conductor connecting with the internal wiring conductor in the ceramic base part 14. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP5289874(B2) 申请公布日期 2013.09.11
申请号 JP20080236003 申请日期 2008.09.16
申请人 发明人
分类号 H01L23/12;H05K3/46 主分类号 H01L23/12
代理机构 代理人
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