High speed method for plating palladium and palladium alloys
摘要
<p>A high speed method of depositing palladium and palladium alloys is disclosed. The high speed method uses an aqueous, ammonia-based bath which has reduced free ammonia in the bath. The high speed method may be used to deposit palladium and palladium alloy coatings on various substrates such as electrical devices and jewelry.</p>
申请公布号
EP2017373(A3)
申请公布日期
2013.09.11
申请号
EP20080160839
申请日期
2008.07.21
申请人
ROHM AND HAAS ELECTRONIC MATERIALS LLC
发明人
ZHANG-BEGLINGER, WAN;CLAUSS, MARGIT;SCHWAGER, FELIX J;GUEBEY, JONAS