| 摘要 |
PURPOSE: An apparatus for inspecting a semiconductor element is provided to reduce inspection time as workers do not need to visually inspect the semiconductor element. CONSTITUTION: A test unit (1200) comprises a test board (1210), and is supplied with test trays. A sensor unit (1320) is installed in a head block (1310) on the upper surface of the test unit and semiconductor element. A test head (1300) allows the sensor unit to contact with the upper surface of the semiconductor element, and connects element leads to a connection pins (1211). A test control unit (1400) applies driving voltage to the element leads, and determined whether the semiconductor element is detective or not based on capacitance measured by the sensor unit. The sensor unit comprises a sensor plate and a probe assembly. The sensor plate is formed to be in contact with the upper surface of the semiconductor element. The probe assembly delivers the capacitance generated between the sensor plate and the semiconductor element to the test control unit. [Reference numerals] (1400) Test control unit |
