发明名称 SEMICONDUCTOR DEVICE
摘要 A semiconductor device (10) includes: an base substance (15) having a ferromagnetic material; a first semiconductor chip (11) and a second semiconductor chip (12) installed on the base substance (15); a first coil (131) installed on the base substance (15) and electrically connected to the first semiconductor chip (11); a second coil (132) installed on the first coil (131), electromagnetically connected to the first coil (131) and electrically connected to the second semiconductor chip (12); a transformer assembly (18) made of a ferromagnetic material and installed on the base substance (15), and a sealing body. The transformer assembly (18) includes a first core section (181), a first side shield section (182), and a first upper shield section (183).
申请公布号 EP2320458(A4) 申请公布日期 2013.09.11
申请号 EP20090800284 申请日期 2009.06.19
申请人 SANKEN ELECTRIC CO., LTD. 发明人 KANAZAWA, MASAKI;ASUKE, HIDEKI
分类号 H01L25/04;H01L23/00;H01L23/29;H01L23/31;H01L23/64;H01L25/00;H01L25/18 主分类号 H01L25/04
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