发明名称 |
SEMICONDUCTOR DEVICE |
摘要 |
A semiconductor device (10) includes: an base substance (15) having a ferromagnetic material; a first semiconductor chip (11) and a second semiconductor chip (12) installed on the base substance (15); a first coil (131) installed on the base substance (15) and electrically connected to the first semiconductor chip (11); a second coil (132) installed on the first coil (131), electromagnetically connected to the first coil (131) and electrically connected to the second semiconductor chip (12); a transformer assembly (18) made of a ferromagnetic material and installed on the base substance (15), and a sealing body. The transformer assembly (18) includes a first core section (181), a first side shield section (182), and a first upper shield section (183). |
申请公布号 |
EP2320458(A4) |
申请公布日期 |
2013.09.11 |
申请号 |
EP20090800284 |
申请日期 |
2009.06.19 |
申请人 |
SANKEN ELECTRIC CO., LTD. |
发明人 |
KANAZAWA, MASAKI;ASUKE, HIDEKI |
分类号 |
H01L25/04;H01L23/00;H01L23/29;H01L23/31;H01L23/64;H01L25/00;H01L25/18 |
主分类号 |
H01L25/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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