发明名称 FLEXIBLE CIRCUIT BOARD AND PRODUCTION METHOD THEREFOR
摘要 <p>The present invention has for its object to provide a flexible circuit board and a method for production thereof in which in cases where elastic wiring in movable parts of a robot, etc., is required, the wiring can be made to expand and contract with a simple arrangement, and at the same time, the circuit board is excellent in weight reduction as well as size reduction, and breaking or disconnection and exfoliation of a wiring layer do not take place easily, even in cases where the circuit board is deformed in a repeated manner. The present invention resides in a flexible circuit board (1) which has an insulating film (2) made of a thermoplastic resin, a wiring layer (3A) formed on said insulating film, and an insulating layer (4) made of a thermoplastic resin and formed on said wiring layer (3A), and which is characterized in that a spiral part (5) shaped into a spiral shape is provided in at least a part of said flexible circuit board, and said flexible circuit board is constructed to be expandable and contractable, and/ or torsionally deformable in said spiral part (5).</p>
申请公布号 EP2563101(A4) 申请公布日期 2013.09.11
申请号 EP20100850284 申请日期 2010.12.24
申请人 NIPPON MEKTRON LTD. 发明人 KAJIYA ATSUSHI;YOSHIHARA HIDEKAZU
分类号 H05K1/02;H01B7/06;H05K1/18 主分类号 H05K1/02
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