发明名称 |
Laminated antenna structures for package applications |
摘要 |
Apparatus and methods for packaging IC chips and laminated antenna structures with laminated waveguide structures that are integrally constructed as part of an antenna package to form compact integrated radio/wireless communications systems for millimeter wave applications. |
申请公布号 |
GB201313708(D0) |
申请公布日期 |
2013.09.11 |
申请号 |
GB20130013708 |
申请日期 |
2012.01.09 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
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