MANUFACTURING METHOD FOR CIRCUIT BOARD COMPRISING ADDITIONAL COPPER ELEMENTS THAT ARE INTEGRATED AND BROUGHT INTO CONTACT BY ULTRASOUND

摘要

The invention relates to a circuit board comprising at least one additional electrically conductive structure that is in the form of a round or rectangular electrically conductive wiring element, in particular in the form of an elongate copper element or element containing copper, that is brought into contact with copper film elements by ultrasound on at least one part on the surface on the copper film elements and is integrated into the circuit board by means of a lamination process. The at least one elongate wiring element has a cross-section that is deformed by means of a specifically formed sonotrode in a contact area that is flat in parts, such that the contact surfaces are at least 20%, in particular more than 30% and more particularly more than 50% greater in a non-deformed contact surface. The wiring element is further deformed in the cross-section in an approximately triangular like manner or in a trapezoidal manner thus increasing the contact surface. Also, the elongate wiring element in brought into contact at defined intervals in a flat manner on a conductive film element that is arranged therebelow.