发明名称 Method for placing a component onto a target platform by an apparatus using a probe
摘要 The present invention relates generally to assembly techniques. According to the present invention, the alignment and probing techniques to improve the accuracy of component placement in assembly are described. More particularly, the invention includes methods and structures to detect and improve the component placement accuracy on a target platform by incorporating alignment marks on component and reference marks on target platform under various probing techniques. A set of sensors grouped in any array to form a multiple-sensor probe can detect the deviation of displaced components in assembly.
申请公布号 US8530248(B2) 申请公布日期 2013.09.10
申请号 US20100779051 申请日期 2010.05.13
申请人 CHEN KONG-CHEN;WINTEC INDUSTRIES, INC. 发明人 CHEN KONG-CHEN
分类号 H01L21/26 主分类号 H01L21/26
代理机构 代理人
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