发明名称 |
Supply voltage or ground connections including bond pad interconnects for integrated circuit device |
摘要 |
Embodiments disclosed herein may relate to supply voltage or ground connections for integrated circuit devices. As one example, two or more supply voltage bond pads on an integrated circuit die may be connected together via one or more electrically conductive interconnects.
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申请公布号 |
US8531849(B1) |
申请公布日期 |
2013.09.10 |
申请号 |
US20100751695 |
申请日期 |
2010.03.31 |
申请人 |
ABDULLA MOSTAFA NAGUIB;ESKILDSEN STEVEN;MICRON TECHNOLOGY, INC. |
发明人 |
ABDULLA MOSTAFA NAGUIB;ESKILDSEN STEVEN |
分类号 |
H05K7/10 |
主分类号 |
H05K7/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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