| 摘要 |
A printed circuit board having adaptable wiring lines includes an insulation layer. Electrode terminals and ball lands are formed on an upper surface of the insulation layer and are separated from each other. Wiring patterns are formed on the insulation layer, interposed between the electrode terminals and the ball lands, and partially removed in a region between the electrode terminals and the ball lands. Conductive members are selectively formed in the regions where the wiring patterns are partially removed to selectively connect the electrode terminals and the ball lands.
|
