发明名称 |
Metal-on passivation resistor for current sensing in a chip-scale package |
摘要 |
A current sense resistor integrated with an integrated circuit die where the integrated circuit die is housed in a chip-scale semiconductor package includes a metal layer formed over a passivation layer of the integrated circuit die where the metal layer has an array of metal pillars extending therefrom. The metal pillars are to be electrically connected to a first conductive trace portion and a second conductive trace portion formed on a printed circuit board where the first conductive trace portion and the second conductive trace portion are electrically isolated from each other and physically separated by a separation of a first distance. The current sense resistor is formed in a portion of the metal layer spanning the separation between the first and second metal trace portions, the first and second conductive trace portions forming terminals of the current sense resistor.
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申请公布号 |
US8531004(B1) |
申请公布日期 |
2013.09.10 |
申请号 |
US201213523792 |
申请日期 |
2012.06.14 |
申请人 |
JACKSON CAMERON;MICREL, INC. |
发明人 |
JACKSON CAMERON |
分类号 |
H01L29/00 |
主分类号 |
H01L29/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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