发明名称 Light emitting diode device with effective heat dissipation
摘要 The present disclosure relates to light emitting diode (LED) devices and methods for fabricating the same. An LED device includes a housing adapted to combine a heat sink with a vapor chamber to form an enclosed space interposed therebetween. The LED device includes light emitting diode modules attached to the housing adjacent to the vapor chamber. The vapor chamber is adapted to uniformly disperse heat generated from the LED modules within the enclosed space to form a uniform temperature field on the heat sink to thereby provide effective heat dissipation.
申请公布号 US8529098(B2) 申请公布日期 2013.09.10
申请号 US20100940151 申请日期 2010.11.05
申请人 LEE HSIAO-WEN;FU HSUEH-HUNG;WANG JIN-HUA;YEH CHIEN-LIANG;TSMC SOLID STATE LIGHTING LTD. 发明人 LEE HSIAO-WEN;FU HSUEH-HUNG;WANG JIN-HUA;YEH CHIEN-LIANG
分类号 F21V29/00 主分类号 F21V29/00
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