发明名称 |
Light emitting diode device with effective heat dissipation |
摘要 |
The present disclosure relates to light emitting diode (LED) devices and methods for fabricating the same. An LED device includes a housing adapted to combine a heat sink with a vapor chamber to form an enclosed space interposed therebetween. The LED device includes light emitting diode modules attached to the housing adjacent to the vapor chamber. The vapor chamber is adapted to uniformly disperse heat generated from the LED modules within the enclosed space to form a uniform temperature field on the heat sink to thereby provide effective heat dissipation.
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申请公布号 |
US8529098(B2) |
申请公布日期 |
2013.09.10 |
申请号 |
US20100940151 |
申请日期 |
2010.11.05 |
申请人 |
LEE HSIAO-WEN;FU HSUEH-HUNG;WANG JIN-HUA;YEH CHIEN-LIANG;TSMC SOLID STATE LIGHTING LTD. |
发明人 |
LEE HSIAO-WEN;FU HSUEH-HUNG;WANG JIN-HUA;YEH CHIEN-LIANG |
分类号 |
F21V29/00 |
主分类号 |
F21V29/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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