| 摘要 |
Ultrasound transducers can be fabricated by bonding a block of piezoelectric material having a conductive coating to a flex circuit that has a conductive region and at least 20 conductive traces disposed on an insulating substrate. The block of piezoelectric material is then diced so as to cut all the way through the block of piezoelectric material and all the way through the conductive region, and part way through, but not completely through, the insulating substrate. The dicing is performed so that the first conductive region is divided into at least 20 regions that are electrically isolated from each other, and each of the at least 20 regions is in electrical contact with a respective one of the at least 20 conductive traces.
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