发明名称 |
Positive photosensitive resin composition, cured film, protective film, interlayer insulating film, and semiconductor device and display element using the same |
摘要 |
A positive photosensitive resin composition includes (A) a polybenzoxazole precursor resin, (B) a photosensitive diazoquinone compound, (C) a hindered phenol antioxidant shown by the following general formula (1), and (D) a phenol compound shown by the following general formula (2). Formula (1) is: wherein R1 represents a hydrogen atom or an organic group having 1 to 4 carbon atoms, a is an integer from 1 to 3, and b is an integer from 1 to 3. Formula (2) is: wherein R2 represents a methylene group or a single bond, c is an integer from 1 to 3, and d is an integer from 1 to 3. A protective film, an interlayer insulating film, and a semiconductor device and a display element using the same are also disclosed.
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申请公布号 |
US8530119(B2) |
申请公布日期 |
2013.09.10 |
申请号 |
US200913321180 |
申请日期 |
2009.05.20 |
申请人 |
HIRANO TAKASHI;BANBA TOSHIO;OKAMYO SHUSAKU;MAKABE HIROAKI;SUMITOMO BAKELITE CO., LTD. |
发明人 |
HIRANO TAKASHI;BANBA TOSHIO;OKAMYO SHUSAKU;MAKABE HIROAKI |
分类号 |
G03F7/023 |
主分类号 |
G03F7/023 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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