| 摘要 |
A packaging structure for plural bare chips includes a substrate, a plurality of bare light-emitting chips, and a transparent light guide. The substrate has a supporting surface. The bare light-emitting chips are disposed on the supporting surface of the substrate. The transparent light guide covers and seals up the bare light-emitting chips, with a side of the transparent light guide facing away from the supporting surface forming a light-outputting layer with a light gathering member. Alternatively, a reflective layer can be arranged on the supporting surface and covered by the transparent light guide. Accordingly, a packaging structure for plural bare chips with high illuminous efficiency, high heat-dissipating efficiency, and low cost of manufacture is provided.
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