发明名称 Multiphoton curing to provide encapsulated optical elements
摘要 Methods of fabricating optical elements that are encapsulated in monolithic matrices. The present invention is based, at least in one aspect, upon the concept of using multiphoton, multi-step photocuring to fabricate encapsulated optical element(s) within a body of a photopolymerizable composition. Imagewise, multiphoton polymerization techniques are used to form the optical element. The body surrounding the optical element is also photohardened by blanket irradiation and/or thermal curing to help form an encapsulating structure. In addition, the composition also incorporates one or more other, non-diffusing binder components that may be thermosetting or thermoplastic. The end result is an encapsulated structure with good hardness, durability, dimensional stability, resilience, and toughness.
申请公布号 US8530118(B2) 申请公布日期 2013.09.10
申请号 US20090545183 申请日期 2009.08.21
申请人 DEVOE ROBERT J.;LEATHERDALE CATHERINE A.;FLORCZAK JEFFREY M.;FLEMING PATRICK R.;POTTS JOHN E.;3M INNOVATIVE PROPERTIES COMPANY 发明人 DEVOE ROBERT J.;LEATHERDALE CATHERINE A.;FLORCZAK JEFFREY M.;FLEMING PATRICK R.;POTTS JOHN E.
分类号 G02B6/10;B29C67/00;B29L11/00;C08F291/00;G02B1/04;G02B3/00;G02B6/12;G02B6/122;G02B6/13;G02B6/138;G03F7/00;G03F7/031;G03F7/20 主分类号 G02B6/10
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