发明名称 |
Chemical mechanical polishing retaining ring |
摘要 |
A chemical mechanical head includes a retaining ring to maintain a substrate beneath the mounting surface during polishing. The retaining ring has a lower portion with a bottom surface for contacting a polishing pad during polishing and made of a first material, such as plastic, and an upper portion made of a second, different material, such as metal.
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申请公布号 |
USRE44491(E1) |
申请公布日期 |
2013.09.10 |
申请号 |
US20060400763 |
申请日期 |
2006.04.06 |
申请人 |
SHENDON NORMAN;SHERWOOD MICHAEL T.;LEE HARRY Q.;APPLIED MATERIALS, INC. |
发明人 |
SHENDON NORMAN;SHERWOOD MICHAEL T.;LEE HARRY Q. |
分类号 |
B24B7/22;B24B37/04;H01L21/304 |
主分类号 |
B24B7/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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