发明名称 Chemical mechanical polishing retaining ring
摘要 A chemical mechanical head includes a retaining ring to maintain a substrate beneath the mounting surface during polishing. The retaining ring has a lower portion with a bottom surface for contacting a polishing pad during polishing and made of a first material, such as plastic, and an upper portion made of a second, different material, such as metal.
申请公布号 USRE44491(E1) 申请公布日期 2013.09.10
申请号 US20060400763 申请日期 2006.04.06
申请人 SHENDON NORMAN;SHERWOOD MICHAEL T.;LEE HARRY Q.;APPLIED MATERIALS, INC. 发明人 SHENDON NORMAN;SHERWOOD MICHAEL T.;LEE HARRY Q.
分类号 B24B7/22;B24B37/04;H01L21/304 主分类号 B24B7/22
代理机构 代理人
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