| 摘要 |
PROBLEM TO BE SOLVED: To provide junction material which uses material with no lead used and secures high reliability in joining metal plates containing no Ni.SOLUTION: As junction material between two kinds of members, lamination material, which is formed by laminating an Ni metal layer and a Cu metal layer on a surface of a lamination structure material formed of a Zn metal layer, an Al metal layer, and a Cu metal layer, is used as the junction material. Thereby, even in a high oxygen concentration atmosphere, the Cu metal layer on the surface protects Zn, Al, Ni of inner layers from oxidation until when the junction material is molten, and wettability and a junction property of the junction material as solder can be maintained. Furthermore, the contained Ni suppresses reaction between a Cu member of a joined material and Zn, and the high reliability of a junction part can be secured. |
