SYMMETRIC PLASMA PROCESS CHAMBER

摘要

PROBLEM TO BE SOLVED: To provide a plasma processing apparatus with improved electrical, gas-flow, and thermal symmetry for plasma uniformity control.SOLUTION: An embodiment comprises: an upper electrode 112 having one or more fluid inlets and one or more fluid outlets; a plurality of conductive fittings 132 coupled to each of the one or more fluid inlets and each of the one or more fluid outlets; and a plurality of conductive plugs 133 coupled to the upper electrode 112 and improving electrical symmetry. The conductive fittings 132 and the conductive plugs 133 are arranged symmetrically about a central axis CA of a substrate support assembly.