| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for mounting an electronic component which achieves high heat radiation performance and inhibits the deformation of an insulation substrate.SOLUTION: A substrate 9 for mounting an electronic component includes: an insulation substrate 1 having an upper surface including a mounting part 1a of the electronic component and a lower surface having multiple grooves 2 and positioned at the opposite side of the upper surface; and a metal material 3 filling the multiple grooves. In the substrate 9 for mounting the electronic component, thermal conductivity of the insulation substrate 1 is improved by the metal material 3 filling the grooves 2 and thus high heat radiation performance is achieved. Further, a range, in which the grooves 2 filled with the metal material 3 are provided, is small relative to the lower surface of the insulation substrate 1, and thus thermal stress acting on the insulation substrate 1 becomes small and the deformation of the insulation substrate 1, such as warpage, is inhibited. |
