SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device which is unlikely to be damaged even when stress is locally applied from outside; and provide a method of manufacturing a semiconductor device with high yield, which has high nondestructive reliability against local stress from outside.SOLUTION: A semiconductor device in which an element layer and a structure including a high strength fiber of an organic compound or of an inorganic compound which is impregnated with an organic resin are fastened is manufactured by providing the structure including the high strength fiber of the organic compound or of the inorganic compound which is impregnated with the organic resin on the element layer having the semiconductor element formed by using an amorphous semiconductor layer, and by performing thermal pressure bonding.