| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique for controlling the distance between two bonded objects appropriately, when bonding two bonded objects via bump electrodes.SOLUTION: A bonding device includes a head for holding a chip, and a stage for holding a substrate. A bump electrode provided on the bonding surface of a chip is heated up to a temperature TM1(<melting point TMm), the head is lowered, two separated bonded objects (chip, substrate) approach relatively, and the bump electrode comes into contact with the substrate in solid phase state. When contact of the bump electrode with the substrate is detected, the value of Z direction position H (displacement) of the head at a moment in time of contact is detected as a reference value SV. Subsequently, while controlling the distance of two holding members (head, stage) by controlling the displacement relatively to the reference value SV, the bonding device heats up the bump electrode furthermore up to a temperature TM2 and melts the bump electrode, thus bonding two bonded objects. |
