| 摘要 |
PROBLEM TO BE SOLVED: To provide division sequential proximity exposure device and method which allow for high speed and high accuracy conveyance of a large-size substrate, while suppressing the manufacturing cost by simplifying the substrate conveyance stage thereby suppressing the up-sizing of an exposure device.SOLUTION: A division sequential proximity exposure device 10 includes a substrate conveyance stage 11, a mask stage including a mask holding section for holding a mask and a mask drive mechanism for driving the mask holding section, a gap sensor for detecting the gap between a substrate W located in an exposure region A and a mask, and lighting means disposed above the mask holding section and irradiating the substrate W with exposure light through the mask. The substrate conveyance stage 11 includes a substrate holding section 20 for holding the substrate W, a substrate conveyance mechanism 19 capable of conveying the substrate holding section 20 in the X direction and Y direction, and a substrate support unit 16 for supporting the substrate W conveyed by the substrate conveyance mechanism 19. |
