| 摘要 |
PROBLEM TO BE SOLVED: To solve such a problem of a power semiconductor device that it is required to increase the possible output of current by decreasing the electrical resistance of a connection, but since a required current possible output is not obtained because the electrical resistance of a connection by wire bonding cannot be decreased, reliability of bonding is insufficient.SOLUTION: A flexible conductive ribbon 404 is ultrasonic bonded from the lead frame 402 of a package to the surface 406 and the terminal 408 of a die 400. Since there are a large number of ribbons 404 and/or bonded regions, various advantages are obtained, as follows. Bonding is reliable because the current possible output is high, the spread resistance decreases and the contact area is large, and the throughput increases at a low cost because the bonding and testing area is narrow. |
