发明名称 THICK FILM SILVER PASTE CONTAINING COPPER AND LEAD-TELLURIUM-OXIDE AND ITS USE IN MANUFACTURE OF SEMICONDUCTOR DEVICES
摘要 PROBLEM TO BE SOLVED: To provide a thick film silver paste containing copper and lead-tellurium-oxide and its use in manufacture of semiconductor devices.SOLUTION: The present invention is directed to a thick film silver paste comprising (i) silver, (ii) copper, and (iii) a Pb-Te-O all dispersed in an organic medium. The present invention is further directed to an electrode formed from the paste, and a semiconductor device and, in particular, a solar cell which comprise such an electrode. The electrodes provide good electrical performance.
申请公布号 JP2013179038(A) 申请公布日期 2013.09.09
申请号 JP20130010365 申请日期 2013.01.23
申请人 E I DU PONT DE NEMOURS & CO 发明人 RAJ G RAJENDRAN
分类号 H01B1/22;H01B1/00;H01L21/285;H01L31/04 主分类号 H01B1/22
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