发明名称 SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a circuit layout which can be reduced in size and which has high degree of freedom in wiring connection.SOLUTION: A semiconductor device comprises: a first region composed of a first and a second region; a first transistor having a first and a second diffusion region and a first control gate formed in the surface of the first region within the first region; a second transistor having a third and a fourth diffusion region and a second control gate formed in the surface of the first region within the second region; a first wiring layer formed on the first and the second control gates along the longer direction of the gates across the first region and the second region; and a first plug CP 2 formed on the first control gate. The first plug is formed in a different region than a region in which the first wiring layer is formed.
申请公布号 JP2013179129(A) 申请公布日期 2013.09.09
申请号 JP20120041376 申请日期 2012.02.28
申请人 TOSHIBA CORP 发明人
分类号 H01L27/10;H01L21/3205;H01L21/336;H01L21/768;H01L21/8234;H01L21/8247;H01L23/522;H01L27/088;H01L27/115;H01L29/788;H01L29/792 主分类号 H01L27/10
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