| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive film for a semiconductor which enables production of a semiconductor chip with an adhesive film with good yield and satisfies both of assemblability and reliability.SOLUTION: A divided semiconductor wafer is obtained by forming, on one surface of a semiconductor wafer 7, cuts for demarcating the semiconductor wafer 7 into a plurality of semiconductor chips and each having a depth smaller than a thickness of the semiconductor wafer 7 and by grinding another surface of the semiconductor wafer 7 until reaching the cuts. The divided semiconductor wafer, an adhesive film 8 for semiconductor, and a dicing tap 3 are laminated. The adhesive film 5 for semiconductor has a thickness of within a range of 1-15 μm, a tensile elongation at break of less than 5%, and the tensile elongation at break less then 110% of elongation at the maximum load. The adhesive film 8 for semiconductor is picked up in a lamination direction of a laminate 20 to be divided to obtain a semiconductor chip with an adhesive film. |
