| 摘要 |
PROBLEM TO BE SOLVED: To provide a housing for an electronic apparatus which enables the weight and thickness reduction without deteriorating the rigidity and enables a complicated shape to be easily formed, and to provide a manufacturing method of the housing for the electronic apparatus.SOLUTION: A housing for an electronic apparatus includes: a composite sheet portion formed by a composite sheet 20 formed by sandwiching a porous resin sheet 24 with high rigidity sheets 24, 26 having rigidity higher than that of the resin sheet 24; and a thermoplastic resin portion joined to at least the resin sheet 24 of the composite sheet portion and formed by a thermoplastic resin 30. |
